What you’ll be doing:
Participating in development of new packaging technologies while working tightly with process development team.
Prepare and conduct experiments to test new assembly technologies and materials.
Operation and maintenance of variety of platforms involved in process of packaging - Wire Bonding/Pick&Place/Active Alignment.
Maintain laboratory hardware and handle materials.
What we need to see:
Electrical/Mechanical Practical Engineer diploma.
5+ years experience in manufacturing environment - microelectronics or packaging.
Operator level on machines involved in packaging process -Pick&Place/flip Chips/BGA/Wire Bonding.
Good attention to detail, as well as clear written and verbal communications.
Ways to stand out from the crowd:
Previous experience in Optical packaging production line.
Demonstrated hands-on experience in two of three leading packaging platforms - Wire Bonding/Pick&Place/Active Alignment.
Previous experience as Engineering Technician in semi-conductor industry.