What you'll be doing:
Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues
What we need to see:
BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar
At least 5 years of experience with complex ASIC package development and manufacturing
Hands-on FEA mechanical simulation experience
Experience co-working with subcontractors and vendors
Vision and focus for projects and team
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule
Ways to stand out from the crowd:
Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)
Background in semiconductor manufacturing processes